Design for Thermal Stresses

Name: Design for Thermal Stresses
Author: Brian R. Barron

written by Brian R. Barron and Randall F. Barron, John Wiley & Sons (Hoboken, NJ: John Wiley & Sons, 2012, originally published 2012), 510 page(s)

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Abstract / Summary: This textbook focuses on the thermal stresses experienced in many engineering designs.
Field of Interest: Global Issues
Author: Brian R. Barron, Randall F. Barron
Corporate Author: John Wiley & Sons
Content Type: General reference book
Duration: 0 sec
Format: Text
Original Publication Date: 2012
Page Count: 510
Publication Year: 2012
Publisher: John Wiley & Sons
Place Published / Released: Hoboken, NJ
Subject: Global Issues, Engineering, Social Sciences, Science & Engineering, Mechanical Engineering, Materials Science, Mechanical engineering, Engineering, Engenharia Mecânica, Ingeniería Mecánica, Ciência dos Materiais, Ciencia de Materiales, Design, Thermal conductivity, Materials science, Mechanical engineering, Stress
Keywords and Translated Subjects: Engenharia Mecânica, Ingeniería Mecánica, Ciência dos Materiais, Ciencia de Materiales, Design, Thermal conductivity, Materials science, Mechanical engineering, Stress